ASUS Pro WS X299 Sage II - motherboard - SSI CEB - LGA2066 Socket - X299

SKU 90SW00U0-M0EAY0
Product Description:ASUS Pro WS X299 Sage II - motherboard - SSI CEB - LGA2066 Socket - X299
Product Type:Motherboard - SSI CEB
Chipset Type:Intel X299
Processor Socket:1 x LGA2066 Socket
Compatible Processors:Core X
Max RAM Size:256 GB
RAM Supported:8 DIMM slots - DDR4, non-ECC, unbuffered
03-01-2025
  • Specifications
  • Description
General
Product Type:Motherboard - SSI CEB
Chipset Type:Intel X299
Processor Socket:LGA2066 Socket
Max Processors Qty:1
Compatible Processors:Core X
Supported RAM
Max Size:256 GB
Technology:DDR4
Bus Clock:2400 MHz, 2666 MHz, 2933 MHz, 3600 MHz (O.C.), 4000 MHz (O.C.), 4133 MHz (O.C.), 4266 MHz (O.C.), 4200 MHz (O.C.)
Supported RAM Integrity Check:Non-ECC
Registered or Buffered:Unbuffered
Features:Intel Extreme Memory Profiles (XMP)
Audio
Type:HD Audio (8-channel)
Audio Codec:Realtek ALCS1220A
Compliant Standards:DTS Connect, High Definition Audio, DTS Headphone:X, DTS:X Ultra
LAN
Network Controller:Intel I225-LM
Network Interfaces:2 x Gigabit Ethernet
Expansion / Connectivity
Expansion Slots:1 x CPU ¦ 8 x DIMM 288-pin ¦ 7 x PCIe 3.0 x16 (x16, x16/x16, x16/x16/x16, x16/x16/x16/x16, x16/x8/x8/x8/x8/x8/x8 modes)
Storage Interfaces:SATA-600 -connectors: 8 x 7pin Serial ATA - RAID 0 / RAID 1 / RAID 10 / RAID 5 ¦ PCIe 3.0 -connectors: 2 x M.2 ¦ PCIe 3.0 -connectors: 3 x U.2
RAID Features:Intel Rapid Storage Technology
Interfaces:2 x LAN (Gigabit Ethernet) ¦ 6 x USB 3.2 Gen 1 ¦ 4 x USB 2.0 ¦ 1 x TOSLINK ¦ 1 x USB 3.2 Gen 2 ¦ 1 x USB-C Gen2 ¦ 1 x audio line-out - mini-jack ¦ 1 x microphone - mini-jack ¦ 1 x audio line-out (center/subwoofer) - mini-jack ¦ 1 x audio line-out (rear) - mini-jack ¦ 1 x audio line-in - mini-jack
Internal Interfaces:2 x USB 3.2 Gen 1 - header ¦ 1 x USB 3.2 Gen 2 - header ¦ 1 x serial - header ¦ 1 x Thunderbolt - header
Power Connectors:24-pin main power connector, 6-pin ATX12V connector, 2 x 8-pin ATX12V connectors
Features
BIOS Features:Multilingual BIOS, ASUS EZ Flash, USB BIOS Flashback
Hardware Features:CrashFree BIOS, jack retasking, ASUS Q-Design, ESD Guards, Q-DIMM, ASUS EZ DIY, Q-LED, Q-Slot, ASUS Q-Connector, audio jack detect technology, ASUS EPU (Energy Processing Unit), ASUS Q-Shield, ASUS TPU (TurboV Processing Unit), Intel Smart Response Technology, NVIDIA 4-way SLI Technology Support, ASUS 8 Phase CPU Power Design, ASUS DIGI+ Power Control, ASUS 2 Phase DRAM Power Design, AMD 4-way CrossFireX technology support, ASUS Enhanced DRAM Overcurrent Protection, Clear CMOS Button, ASUS Stainless Steel Back I/O, ASUS Fan Xpert 3, Dual Intelligent Processors 5, ASUS Overvoltage Protection, ASUS Crystal Sound 3, Intel Turbo Boost Technology 3.0, Intel Optane Memory Ready, ASUS 5X Protection III, ASUS SafeSlot Core, Intel VROC support, ASUS PRO Clock II Technology, ASUS Aura Sync
Miscellaneous
Included Accessories:I/O back plate, 1 x M.2 screw, 2-Way SLI Bridge, vertical M.2 bracket set, MOS cooling kit, 3-Way SLI Bridge, Q-Connector, 4-Way SLI Bridge
Cables Included:1 x serial panel ¦ 8 x Serial ATA cable
Software Included:ASUS AI Charger+, ASUS AI Suite III, ASUS Turbo App
Width:30.5 cm
Depth:26.7 cm
vis mere
ASUS Pro Workstation motherboards are designed for professionals in AI training, deep learning, animation, 3D rendering or media production. Featuring expandable graphics, extensive storage, impressive connectivity and exceptional overall performance and reliability, Pro Workstation motherboards are the ideal solution for creative professionals. Each motherboard includes centralized management software with support for out-of-band management, so they're also an efficient and cost-effective option for IT administrators.
  • Ready for advanced processors
  • AI Overclocking quickly optimizes CPU performance by profiling the CPU and cooler
  • Dual Intel 2.5G LAN offers increased data throughput and improved efficiency, making it ideal for large file transfers and backup
  • Includes 7 PCIe slots and supports NVIDIA SLI and AMD CrossFire
  • Ultra-efficient VRM heatsink: metal-fin-array design maximizes surface area for heat dissipation to enable outstanding performance
  • Advanced connectivity for fast transfer speeds




The technical details come from 3rd party. edgemo is not responsible for any errors.

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